Call for Papers

Important Dates

Full Paper Submission: January 31st, 2022
Notification of Acceptance: March 31th, 2022

Call for Papers

A PDF version of this SPI 2022 call for papers can be downloaded here.

The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. Detailed instructions for manuscript submission are available here. All contributions will be subjected to a rigorous review process, conducted by the TPC. Accepted papers will be included in the conference program and will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Topics of Interest

  • Modeling and simulation for SI/PI
  • Coupled signal and power Integrity analysis
  • Noise reduction and equalization techniques
  • High-speed link design and modeling
  • Power distribution networks
  • RF/microwave/mm-wave systems and packaging solutions
  • Antennas-in-package and antennas-on-chip
  • 3D IC and packages (TSV/SiP/SoC)
  • Nano-interconnects and nano-structures
  • Electromagnetic theory and modeling
  • Transmission line theory and modeling
  • Macromodeling, reduced order models
  • Electromagnetic compatibility
  • Design methodology/flow measurements
  • Jitter and noise modeling
  • Stochastic/sensitivity analysis
  • Electro-thermal modeling
  • Chip-package co-design
  • Novel CAD concepts
  • Optical interconnects
  • AI in electronics design

Best Student Paper Award

In order to recognize excellence in research, a Best Student Paper Award will be assigned by the TPC based on the following criteria:

  • Novelty
  • Advancement of the theory and application
  • Quality of the presented results
  • Quality of the written manuscript
  • Practicality and industrial relevance of the presented work

Each accepted paper authored by a student is eligible for the SPI Best Student Paper Award, provided that the student is the first and primary author, and the presenter at the conference.