Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. Regarding the success in previous years, the committee is looking forward to the 26th edition which will take place in Siegen, Germany. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. On this web site you can find all information regarding the 26th IEEE Workshop on Signal and Power Integrity.